PN Junction
Diode
Study PN junction formation, depletion region, barrier potential, forward & reverse bias, V-I characteristics, junction capacitance, Zener & avalanche breakdown and nuclear stability concepts.
PN Junction Diode
Fundamentals, definition, importance and applications of the PN junction diode.
A PN Junction Diode is a two-terminal semiconductor device formed when a p-type semiconductor is joined with an n-type semiconductor, creating a junction at the interface. It allows current to flow predominantly in one direction (forward bias) and blocks it in the other (reverse bias).
When a p-type semiconductor (doped with acceptor impurities, majority carriers = holes) is brought in contact with an n-type semiconductor (doped with donor impurities, majority carriers = electrons), a metallurgical junction forms between the two regions.
- P-type: majority carriers are holes; minority carriers are electrons
- N-type: majority carriers are electrons; minority carriers are holes
- At the junction, diffusion of charge carriers occurs spontaneously
- An internal electric field develops opposing further diffusion
- Rectification: converts AC to DC (rectifier circuits)
- Signal clipping and clamping circuits
- Voltage regulation (Zener diode application)
- Logic gates and switching circuits
- Light emission (LED) and detection (photodiode)
- Solar cells (photovoltaic effect)
- Frequency mixing and detection in communication
- Protection against reverse polarity in circuits
- Silicon (Si) and Germanium (Ge) are most common semiconductor materials
- Si bandgap ≈ 1.12 eV; Ge bandgap ≈ 0.67 eV
- Doping introduces controlled impurity atoms
- Trivalent dopants (B, Al, In) → p-type
- Pentavalent dopants (P, As, Sb) → n-type
- Conductivity increases enormously with doping
PN Junction Formation
How diffusion, recombination and drift combine to form the PN junction.
- Electrons (majority carriers in n-type) diffuse toward the p-side due to concentration gradient.
- Holes (majority carriers in p-type) diffuse toward the n-side for the same reason.
- Electrons recombine with holes near the junction, annihilating both.
- This leaves positive donor ions exposed on the n-side and negative acceptor ions on the p-side.
- These immobile fixed charges create an internal electric field E pointing from n-side to p-side.
- The electric field opposes further diffusion (drift current opposes diffusion current).
- Equilibrium is reached when drift current = diffusion current for each carrier type.
| Carrier | From → To | Type of Current |
|---|---|---|
| Electrons | N-side → P-side | Diffusion current |
| Holes | P-side → N-side | Diffusion current |
| Electrons | P-side → N-side | Drift current (minor) |
| Holes | N-side → P-side | Drift current (minor) |
Depletion Region
Formation, width, fixed charges and its role in junction physics.
The Depletion Region (also called the space charge region or transition region) is the thin layer at the PN junction that is depleted of mobile charge carriers (both electrons and holes) and contains only fixed ionised donor and acceptor atoms.
- Fixed positive charges on n-side: ionised donor atoms (e.g., As+)
- Fixed negative charges on p-side: ionised acceptor atoms (e.g., B−)
- No mobile charge carriers inside the depletion region
- Acts as an insulating barrier at equilibrium
- Width ≈ 0.5 µm for Si at typical doping levels
- Width is thinner in heavily doped junctions
- Width increases under reverse bias; decreases under forward bias
Barrier Potential
Built-in potential, energy band representation and its effect on current flow.
The barrier potential (also called contact potential or built-in voltage V0) is the potential difference that develops across the depletion region at equilibrium due to the separation of positive and negative space charges.
- It opposes the further diffusion of majority carriers across the junction
- It is NOT a source of EMF and cannot drive external current by itself
- For Silicon (Si): V0 ≈ 0.6 to 0.7 V
- For Germanium (Ge): V0 ≈ 0.2 to 0.3 V
- Barrier potential decreases as temperature increases
- Majority carriers (holes from p, electrons from n) face a potential barrier and cannot cross easily
- Minority carriers (electrons in p, holes in n) are accelerated across by the built-in field → drift current
- At equilibrium: diffusion current = drift current → net current = zero
- To conduct external current, barrier must be reduced (forward bias) or increased (reverse bias)
Silicon
V0 ≈ 0.6 – 0.7 V at room temperature
Germanium
V0 ≈ 0.2 – 0.3 V at room temperature
Temperature Effect
V0 decreases ≈ 2.5 mV/°C as T rises
Forward Bias
External voltage reduces barrier potential, enabling majority carrier current flow.
When the positive terminal of an external battery is connected to the p-side and the negative terminal to the n-side, the diode is said to be in forward bias. The applied voltage opposes the built-in potential, reducing the barrier and allowing large current to flow.
- External voltage V applied with + to p-side, − to n-side.
- Applied electric field opposes the built-in field E0.
- Net barrier reduces from V0 to (V0 − V).
- Depletion width narrows.
- Majority carriers gain enough energy to cross the junction.
- Large forward current IF flows (milliamperes to amperes).
Threshold Voltage
Si: ~0.6–0.7 V
Ge: ~0.2–0.3 V
Barrier Reduction
New barrier = V0 − Vforward
Current Direction
Conventional current: P → N (Anode → Cathode)
Reverse Bias
External voltage increases barrier, widens depletion region, allows only tiny minority carrier current.
When the negative terminal of a battery is connected to the p-side and the positive terminal to the n-side, the diode is in reverse bias. The applied voltage aids the built-in potential, increasing the barrier height and depletion width, blocking majority carrier flow.
- External voltage VR applied with − to p-side, + to n-side.
- Applied field adds to built-in field E0.
- Barrier height increases to (V0 + VR).
- Depletion region widens significantly.
- Majority carriers are pushed away from junction.
- Only minority carriers cross → tiny reverse saturation current I0 (µA range).
| Parameter | Silicon | Germanium |
|---|---|---|
| Reverse saturation current I0 | nA range | µA range |
| Reverse breakdown voltage | Higher (~50-200 V) | Lower (~25-100 V) |
| Temperature sensitivity of I0 | Doubles/10°C rise | Doubles/10°C rise |
V-I Characteristics
Forward and reverse bias current-voltage curves for Silicon and Germanium diodes.
- Cut-in / Knee voltage: Si ≈ 0.6–0.7 V; Ge ≈ 0.2–0.3 V
- Below knee voltage: negligible current flows
- Above knee: current rises exponentially
- Dynamic forward resistance rf = ΔV/ΔI (low, few ohms)
- Static resistance RF = VF/IF
- Tiny reverse saturation current I0 flows (µA/nA)
- I0 nearly constant until breakdown
- At breakdown voltage VBR: current suddenly increases
- Dynamic reverse resistance rr = ΔV/ΔI (very high, MΩ)
- For Si: VBR typically 50–200 V
Junction Capacitance
Transition capacitance in reverse bias and diffusion capacitance in forward bias.
The depletion region acts like the dielectric of a parallel-plate capacitor. This capacitance is dominant in reverse bias.
- ε = permittivity of semiconductor
- A = junction cross-sectional area
- W = depletion width (increases with reverse voltage)
- CT decreases as reverse voltage increases (W increases)
- CT ∝ 1/√VR for abrupt junctions
- Used in varactor (varicap) diodes for tuning
Due to minority carrier charge storage on either side of the junction. Dominant in forward bias.
- τ = minority carrier lifetime
- gm = transconductance of the diode
- CD increases with forward current IF
- Much larger than CT under forward bias
- Limits high-frequency switching performance
| Property | Transition CT | Diffusion CD |
|---|---|---|
| Bias condition | Reverse bias | Forward bias |
| Origin | Depletion layer charges | Minority carrier storage |
| Magnitude | Small (pF range) | Large (nF range) |
| Varies with voltage as | Decreases with VR | Increases with IF |
| Application | Varactor diode tuning | Limits switching speed |
Reverse Breakdown
When reverse voltage exceeds breakdown voltage, current surges due to Zener or avalanche effect.
Zener Breakdown
- Occurs in heavily doped junctions with very thin depletion regions (≈5–10 nm)
- High electric field (≈107 V/m) across thin depletion layer
- Valence electrons tunnel directly through the thin barrier (quantum tunnelling)
- Breakdown voltage VZ < 6 V for Si at room temperature
- VZ has a negative temperature coefficient: VZ decreases as temperature rises
- Used intentionally in Zener diodes for voltage regulation
Avalanche Breakdown
- Occurs in lightly doped junctions with wide depletion regions
- Minority carriers accelerated by large reverse electric field
- High-energy carriers collide with lattice atoms → impact ionisation
- Each collision creates new electron-hole pairs
- New carriers also accelerate → avalanche multiplication
- Breakdown voltage VAV > 6 V
- VAV has a positive temperature coefficient: increases as temperature rises
- Multiplication factor M = 1 / [1 − (V/VBR)n]
| Property | Zener Breakdown | Avalanche Breakdown |
|---|---|---|
| Doping level | Heavy (both sides) | Light (both sides) |
| Depletion width | Very thin | Wide |
| Mechanism | Quantum tunnelling | Impact ionisation |
| Breakdown voltage | < 6 V (for Si) | > 6 V (for Si) |
| Temperature coefficient | Negative (VZ ↓ as T ↑) | Positive (VAV ↑ as T ↑) |
| Electric field required | ~107 V/m | ~106 V/m |
| Application | Voltage regulators | Avalanche photodiodes |
Important Comparison Tables
Forward Bias vs Reverse Bias
| Property | Forward Bias | Reverse Bias |
|---|---|---|
| Battery connection | + to p-side, − to n-side | − to p-side, + to n-side |
| Effect on barrier | Reduces barrier potential | Increases barrier potential |
| Depletion width | Decreases | Increases |
| Current magnitude | Large (mA to A) | Tiny (µA/nA) |
| Resistance | Very low (few Ω) | Very high (MΩ) |
| Carrier flow | Majority carriers cross junction | Only minority carriers cross |
| Diode condition | ON (conducting) | OFF (non-conducting) |
| Threshold voltage (Si) | ~0.7 V needed | No threshold; immediate blocking |
Silicon vs Germanium Diode
| Property | Silicon Diode | Germanium Diode |
|---|---|---|
| Bandgap energy | 1.12 eV | 0.67 eV |
| Knee (cut-in) voltage | 0.6–0.7 V | 0.2–0.3 V |
| Reverse saturation current I0 | nA (very small) | µA (larger) |
| Operating temperature range | Up to ~150°C | Up to ~75°C |
| Reverse breakdown voltage | Higher | Lower |
| Leakage current | Very low | Relatively higher |
| Most widely used | Yes (preferred) | Less common today |
Important Numericals
Step-by-step solved problems — CBSE, NEET, JEE Main, JEE Advanced, IB, IGCSE, A-Level.
e25 ≈ 7.2 × 1010
CT = (1.035 × 10−10 × 10−6) / (5 × 10−7) = 2.07 × 10−10 F ≈ 207 pF
NA × ND / ni2 = (1017 × 1015) / (1.5 × 1010)2 = 1032 / (2.25 × 1020) = 4.44 × 1011
ln(4.44 × 1011) = ln(4.44) + 11 × ln(10) = 1.49 + 25.33 = 26.82
V0 = 0.026 × 26.82 ≈ 0.697 V
(b) Vdc = Vpeak / π = 12 / 3.14 ≈ 3.82 V
(c) PIV = Vpeak = 12 V
Ripple frequency = 2 × input frequency = 2 × 50 = 100 Hz
Number of 10°C intervals = 20/10 = 2
I0(47°C) = I0(27°C) × 22 = 2 × 4 = 8 µA
Current I = VR/R = 4.3 / 330 = 13.0 mA
R = VR/I = 7.0 / (20 × 10−3) = 350 Ω
Pdc = Idc2 × RL = (Im/π)2 × RL
Pac = Irms2 × RL = (Im/2)2 × RL
η = [(Im/π)2]/[(Im/2)2] = 4/π2 ≈ 0.406 = 40.6%
Previous Year Questions
NEET PYQs
JEE Main PYQs
JEE Advanced PYQs
CBSE PYQs
IB Physics Questions
IGCSE Questions
A-Level Questions
Case Study Questions
Assertion-Reason Questions
Select the correct option: (A) Both A and R are true; R is correct explanation of A. (B) Both true; R is NOT correct explanation. (C) A is true; R is false. (D) A is false; R is true. (E) Both false.
Quick Revision Box
All essential formulas, definitions and constants for PN Junction Diode — exam ready
⚠ Students Often Under-prepare This Chapter
Many students focus extensively on Optics and Electromagnetism while treating PN Junction Diode as a "small topic." This is a serious mistake.
NEET, JEE Main, JEE Advanced, CBSE, IB, IGCSE and A-Level examinations consistently include questions on the V-I characteristic, depletion region, barrier potential, rectifier circuits and breakdown mechanisms. Numerical questions on dynamic resistance, ripple voltage, Zener regulation and junction capacitance appear regularly at JEE Advanced and IB levels.
This chapter forms the foundation of all semiconductor electronics — transistors, op-amps, logic circuits and communication systems all build upon the PN junction. A weak foundation here creates cascading difficulties throughout the course.
Still Confused About PN Junction Diode?
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